Headphone

- SONY GOURP CORPORATION
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Description

FIG. 1 is a front, bottom, right perspective view of a headphone showing my new design;

FIG. 2 is a rear, top, right perspective view thereof;

FIG. 3 is a rear, bottom, right perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; and

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a partially enlarged front, bottom, right perspective view thereof along the lines 8-8 and 8′-8′ of FIG. 1.

The broken lines illustrating portions of the headphone form no part of the claimed design. The dot-dash broken lines defining boundaries of the claimed design form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

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Patent History
Patent number: D1091502
Type: Grant
Filed: Sep 26, 2023
Date of Patent: Sep 2, 2025
Assignee: SONY GOURP CORPORATION (Tokyo)
Inventor: Soichi Tanaka (Kanagawa)
Primary Examiner: Paula Allen Greene
Application Number: 29/913,018
Classifications
Current U.S. Class: With Microphone (D14/206)