Case for mobile electronic device
Latest SAMSUNG ELECTRONICS CO., LTD. Patents:
Description
The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.
Claims
The ornamental design for a case for mobile electronic device, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
| D984428 | April 25, 2023 | Myung |
| D986874 | May 23, 2023 | Myung |
| D999199 | September 19, 2023 | Yoon |
| D1014485 | February 13, 2024 | Lee |
| D1014486 | February 13, 2024 | Lee |
| D1016051 | February 27, 2024 | Choi |
| D1018513 | March 19, 2024 | Choi |
| D1018516 | March 19, 2024 | Shi |
| D1024042 | April 23, 2024 | Choi |
| D1024043 | April 23, 2024 | Choi |
| D1024044 | April 23, 2024 | Choi |
| D1024045 | April 23, 2024 | Choi |
| D1026884 | May 14, 2024 | Weng |
| D1027961 | May 21, 2024 | Weng |
| 12010252 | June 11, 2024 | Feng |
| D1037234 | July 30, 2024 | Jung |
| D1040794 | September 3, 2024 | Kim |
| D1040795 | September 3, 2024 | Kim |
| D1040797 | September 3, 2024 | Kim |
| D1047986 | October 22, 2024 | Chung |
| D1053177 | December 3, 2024 | Yoon |
| D1057722 | January 14, 2025 | Lim |
| 20230300228 | September 21, 2023 | Mody |
- Samsung Galaxy Z Fold5 Eco Leather Phone Case, publication date Jul. 26, 2023, [online] URL: https://www.amazon.com/SAMSUNG-Leather-Protective-EF-VF946PBEGUS-Graphite/dp/B0C7CWCWY3/ (Year: 2023).
- Spigen Tough Armor Pro P Designed for Galaxy Z Fold 6 Case (2024), publication date Jul. 9, 2024, [online] URL: https://www.amazon.com/Spigen-Compatible-Samsung-Galaxy-Built/dp/B0CXVC2K32 (Year: 2024).
Patent History
Patent number: D1101729
Type: Grant
Filed: Oct 17, 2023
Date of Patent: Nov 11, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Duyeong Choi (Suwon-si), Kihwan Kwon (Suwon-si), Namsu Kim (Suwon-si), Miri Lee (Suwon-si), Dahyun Lee (Suwon-si), Jieun Myung (Suwon-si), Jiyun Lim (Suwon-si), Sungwook Lee (Suwon-si)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/905,157
Type: Grant
Filed: Oct 17, 2023
Date of Patent: Nov 11, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Duyeong Choi (Suwon-si), Kihwan Kwon (Suwon-si), Namsu Kim (Suwon-si), Miri Lee (Suwon-si), Dahyun Lee (Suwon-si), Jieun Myung (Suwon-si), Jiyun Lim (Suwon-si), Sungwook Lee (Suwon-si)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/905,157
Classifications
Current U.S. Class:
Cover For Base Or Handset (D14/250)