Recessed heat sink with a discernible component as part of a device enclosure

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Description

FIG. 1 is a front perspective view of a recessed heat sink with a discernible component as part of a device enclosure;

FIG. 2 is a front corner perspective view of the recessed heat sink with a discernible component as part of a device enclosure;

FIG. 3 is a top view of the recessed heat sink with a discernible component as part of a device enclosure;

FIG. 4 is a front view of the recessed heat sink with a discernible component as part of a device enclosure;

FIG. 5 is a back view of the recessed heat sink with a discernible component as part of a device enclosure;

FIG. 6 is a left-side view of the recessed heat sink with a discernible component as part of a device enclosure;

FIG. 7 is a right-side view of the recessed heat sink with a discernible component as part of a device enclosure; and,

FIG. 8 is a bottom view of the recessed heat sink with a discernible component as part of a device enclosure.

The dashed broken lines depict boundaries; each dashed line and the area within form no part of the claimed design.

Claims

The ornamental design for a recessed heat sink with a discernible component as part of a device enclosure as shown and described.

Referenced Cited
U.S. Patent Documents
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Foreign Patent Documents
304705117 June 2018 CN
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Other references
  • Heat-Sink Redesign, posted date Dec. 7, 2021, retrieved May 15, 2025, https://www.metalformingmagazine.com/article/?/software/design-simulation/heat-sink-redesign-for-motorsports-application-delivers-big-cooling-gains (Year: 2021).
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Patent History
Patent number: D1107668
Type: Grant
Filed: Dec 6, 2023
Date of Patent: Dec 30, 2025
Assignee: SK Hynix NAND Product Solutions Corp. (Rancho Cordova, CA)
Inventor: Saad Bushnaq (Richmond)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria' L Simmons-Holloway
Application Number: 29/919,815
Classifications
Current U.S. Class: Heat Sink (D13/179)