RF modular assembly for a RF system
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The broken line showing of radio frequency modular assembly for RF System is for the purpose of illustrating portions of the article or environmental structure and forms no part of the claimed design.
Claims
The ornamental design for a RF modular assembly for a RF system as shown and described.
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- Design U.S. Appl. No. 29/697,225, Radio Requency Modular Assembly and System, filed Jul. 5, 2019.
Type: Grant
Filed: Nov 21, 2022
Date of Patent: Jan 6, 2026
Assignee: Siemens Canada Limited (Oakville)
Inventors: Vincent Holger Weckert (Nuremberg), Jan Andersson (Fürth), Jaspreet Singh (Milton), Maximilian Seiffert (Karlsruhe), Attila Apro (Barrie)
Primary Examiner: Joseph Kukella
Assistant Examiner: Francis Wilder
Application Number: 29/868,130