Radio frequency module

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Description

FIG. 1 is a front perspective view a radio frequency module, showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a top plan view thereof.

FIG. 6 is a right side elevational view thereof.

FIG. 7 is a left side elevational view thereof.

FIG. 8 is a front elevational view of a radio frequency module showing another embodiment of our new design. The front perspective view of the radio frequency module of this embodiment is the same as FIG. 1.

FIG. 9 is a rear elevational view thereof.

FIG. 10 is a bottom plan view thereof.

FIG. 11 is a top plan view thereof.

FIG. 12 is a right side elevational view thereof.

FIG. 13 is a left side elevational view thereof.

FIG. 14 is a front elevational view of a radio frequency module showing yet another embodiment of our new design. The front perspective view of the radio frequency module of this embodiment is the same as FIG. 1 except for the box-like structure shown in the upper right hand corner of FIG. 1 is omitted.

FIG. 15 is a rear elevational view thereof.

FIG. 16 is a bottom plan view thereof.

FIG. 17 is a top plan view thereof.

FIG. 18 is a right side elevational view thereof.

FIG. 19 is a left side elevational view thereof.

FIG. 20 is a front elevational view of a radio frequency module showing yet another embodiment of our new design. The front perspective view of the radio frequency module of this embodiment is the same as FIG. 1 except for the box-like structure shown in the upper right hand corner of FIG. 1 is omitted.

FIG. 21 is a rear elevational view thereof.

FIG. 22 is a bottom plan view thereof.

FIG. 23 is a top plan view thereof.

FIG. 24 is a right side elevational view thereof.

FIG. 25 is a left side elevational view thereof.

FIG. 26 is a front elevational view of a radio frequency module showing yet another embodiment of our new design. The front perspective view of the radio frequency module of this embodiment is the same as FIG. 1 except that the box-like structure shown in the upper right hand corner of FIG. 1 is slightly larger.

FIG. 27 is a rear elevational view thereof.

FIG. 28 is a bottom plan view thereof.

FIG. 29 is a top plan view thereof.

FIG. 30 is a right side elevational view thereof.

FIG. 31 is a left side elevational view thereof.

FIG. 32 is a front elevational view of a radio frequency module showing yet another embodiment of our new design. The front perspective view of the radio frequency module of this embodiment is the same as FIG. 1 except for the box-like structure shown in the upper right hand corner of FIG. 1 is omitted.

FIG. 33 is a rear elevational view thereof.

FIG. 34 is a bottom plan view thereof.

FIG. 35 is a top plan view thereof.

FIG. 36 is a right side elevational view thereof; and,

FIG. 37 is a left side elevational view thereof.

Shading lines in the drawings are intended to represent the three dimensional contour of the design and are not intended to indicate surface ornamentation. The broken lines in the views that are immediately adjacent to the shaded areas and form unshaded regions represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.

Claims

The ornamental design for a radio frequency module, substantially as shown and described.

Referenced Cited
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Other references
  • Scribd.com, Cinterion Wirelees Modules, “BG2 Market-Intro Jan. 2010v7 External”, posted, © 2011 Scribd Inc., [online], [site visited Nov. 3, 2011]. Available from Internet, <URL: http://www.scribd.com/doc/39879408/BG2-Market-Intro-Jan-2010v7-External>.
  • “Cinterion Wireless Modules Portfolio and Photos” Presentation, © Cinterion Wireless Modules GmbH 2010, 7 pages.
Patent History
Patent number: D655697
Type: Grant
Filed: Jul 20, 2010
Date of Patent: Mar 13, 2012
Assignee: Cinterion Wireless Modules GmbH (Munich)
Inventor: Carsten Petsch (Berlin)
Primary Examiner: Jeffrey D Asch
Attorney: Seed IP Law Group PLLC
Application Number: 29/366,148