Abstract: A method for 3D integration may include forming a first layer of packaging laminate substrate material including a first plurality of vias formed therein. The method may additionally include forming a second layer of packaging laminate substrate material having a second plurality of vias formed therein. The method may also include stacking the first plurality of vias with the second plurality of vias. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method may include mounting a system on chip face down on a fanout package structure in a manner that bonds the system on chip face to face with one or more functional chips included in the fanout package structure. The method may also include mounting an additional functional chip on the system on chip and bonding the additional functional chip to the system on chip. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method for three part system on chip memory stacking may include positioning a packaging laminate substrate between a system on chip and a functional chip, wherein the functional chip is connected to the system on chip by a via stack included in the packaging laminate substrate. The method may also include mounting an additional functional chip on the system on chip and bonding the additional functional chip to the system on chip. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Aspects of the disclosure relate to a multipoint environment in which a first approach, a second approach, or a combination of a first and second approach can be used to serve outgoing stations (STAs) with minimal service disruptions. For example, in a first approach, an outgoing access point (AP) is assigned a non-serving all stations (non-SAS) contention-based access period (CBAP) resource in which the outgoing AP is allowed to transmit packets remaining in a queue just to outgoing STAs. In a second approach, an outgoing AP is assigned a non-SAS CBAP resource in which the outgoing AP is disallowed from serving the outgoing STAs, causing the outgoing APs to flush packets remaining in queue for the outgoing STAs. The outgoing AP informs an AP controller of an identity of the flushed packets, and the AP controller then instructs an incoming AP to transmit those packets to the outgoing STA.

Abstract: Aspects of this disclosure relate to methods of cross layer rate selection and related controllers and systems. A media access control scheduler can select a rate for transmitting data for a wireless terminal based on a queue stability metric and a predicted transmission rate associated with the wireless terminal. Information identifying the rate can be sent to an application server. The rate can then be used by application server to send data for the wireless terminal to an access point via an access point controller, in which the access point can wirelessly serve the wireless terminal.

Abstract: A snout assembly of a laser pump module may include a snout bulkhead comprising an opening along a longitudinal axis of the snout bulkhead. The snout assembly may include a ferrule in the opening of the snout bulkhead. The snout assembly may include a metallization layer on a portion of an outer surface of the ferrule. The snout assembly may include a copper-silver (CuAg) solder material between the metallization layer and a surface of the opening. The CuAg solder material may bond the ferrule and the snout bulkhead.

Abstract: The invention relates to a texturised hybrid meat analogue comprising both plant and animal protein, and a method of preparing the same. The texturised hybrid meat analogue is comparable to meat in terms of its textural and nutritional properties.

Abstract: A method includes collecting current data and architecture state, collecting future data and architecture state; analyzing the current and/or future data and architecture state to generate deployment options; and causing the summary of options to be displayed. A computing system includes a processor and a memory comprising instructions, that when executed, cause the system to collect current data and architecture state, collect future data and architecture state; analyze the current and/or future data and architecture state to generate deployment options; and cause the summary of options to be displayed. A non-transitory computer-readable storage medium includes executable instructions that, when executed by a processor, cause a computer to collect current data and architecture state, collect future data and architecture state; analyze the current and/or future data and architecture state to generate deployment options; and cause the summary of options to be displayed.

Abstract: The invention relates to method and system for classifying events (well control events) during drilling operations. The method includes determining drilling attributes corresponding to volve drilling data in a predefined format and associated with one or more wells; determining a correlation value between each two attributes of the drilling attributes associated with the volve drilling data; selecting a set of drilling attributes from the drilling attributes based the determined correlation value; generating a labelled dataset corresponding to the volve drilling data based on the set of drilling attributes by determining a value of one or more additional drilling attributes associated with the volve drilling data based on the set of drilling attributes; and training a supervised Machine Learning (ML) model based on the labelled dataset and real-time drilling data for classifying each of the one or more drillings events in one of a set of pre-defined categories.

Abstract: A system that includes a wettable thermal insulator, a phase change material, and a flexible pouch. In the event a thermal event occurs, the phase change material changes from a liquid state to a gaseous state. The flexible pouch is configured to envelope the wettable thermal insulator and the phase change material in the liquid state.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a destination address that matches an address of the AP or that matches a wildcard address associated with the AP, irrespective of the source address included in the header of the data packet.

Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Abstract: A multi-chiplet assembly may include a first logic chiplet. A multi-chiplet assembly may include a memory chiplet electrically coupled to the first logic chiplet. A multi-chiplet assembly may include a second logic chiplet. A multi-chiplet assembly may include a bridging chiplet electrically coupling the first logic chiplet to the second logic chiplet. Various other apparatuses, systems, and methods are also disclosed.

Abstract: Various methods, apparatuses, and media for processing a transaction are provided. A request to process the transaction is received. The request includes a plurality of pieces of transaction data. An initial contract is identified, based on at least a first piece of the transaction data, and loaded. The initial contract includes a plurality of mono-services, with each of the mono-services being a function literal that includes a defined input and output and being configured to implement exactly one piece of functionality. The initial contract is executed, with the mono-services being configured to return a result for responding to the request to process the transaction.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a destination address that matches an address of the AP or that matches a wildcard address associated with the AP, irrespective of the source address included in the header of the data packet.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a source address that matches an address of an authenticated STA, irrespective of the destination address included in the header of the data packet.

Abstract: A system that includes a wettable thermal insulator, a phase change material, and a flexible pouch. In the event a thermal event occurs, the phase change material changes from a liquid state to a gaseous state. The flexible pouch is configured to envelope the wettable thermal insulator and the phase change material in the liquid state.

Abstract: ML methods and systems for cataloging and making recommendations based on domain-specific knowledge are disclosed. An example method includes: cataloging, using knowledge engines, data to develop knowledge repositories for respective domains; obtain current domain state data; obtain future domain state data; analyze, using first ML models, one or more of (i) data from the knowledge repositories, (ii) the first domain state data, and (iii) the second domain state data to identify a recommended set of one or more regulations, standards, policies and/or rules for a desired second domain state; analyze, using second ML models, (i) the recommended set and (ii) a current data and architecture state for a current computing environment to generate a summary of one or more cloud deployment options for migrating a current computing environment to a future computing environment for a future domain state; and cause the summary to be displayed on a computing device.

Abstract: A time-of-flight (ToF) module includes a light source, a driver module, and a light sensor. The driver module includes electrical circuitry configured to selectively drive the light source to emit pulsed illumination light. The light sensor is configured to sense returning light reflected from a target. At least one of the light source, driver module, and light sensor is stacked on another to reduce a footprint of the ToF module.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.