Abstract: A method includes collecting current data and architecture state, collecting future data and architecture state; analyzing the current and/or future data and architecture state to generate deployment options; and causing the summary of options to be displayed. A computing system includes a processor and a memory comprising instructions, that when executed, cause the system to collect current data and architecture state, collect future data and architecture state; analyze the current and/or future data and architecture state to generate deployment options; and cause the summary of options to be displayed. A non-transitory computer-readable storage medium includes executable instructions that, when executed by a processor, cause a computer to collect current data and architecture state, collect future data and architecture state; analyze the current and/or future data and architecture state to generate deployment options; and cause the summary of options to be displayed.

Abstract: The invention relates to method and system for classifying events (well control events) during drilling operations. The method includes determining drilling attributes corresponding to volve drilling data in a predefined format and associated with one or more wells; determining a correlation value between each two attributes of the drilling attributes associated with the volve drilling data; selecting a set of drilling attributes from the drilling attributes based the determined correlation value; generating a labelled dataset corresponding to the volve drilling data based on the set of drilling attributes by determining a value of one or more additional drilling attributes associated with the volve drilling data based on the set of drilling attributes; and training a supervised Machine Learning (ML) model based on the labelled dataset and real-time drilling data for classifying each of the one or more drillings events in one of a set of pre-defined categories.

Abstract: A system that includes a wettable thermal insulator, a phase change material, and a flexible pouch. In the event a thermal event occurs, the phase change material changes from a liquid state to a gaseous state. The flexible pouch is configured to envelope the wettable thermal insulator and the phase change material in the liquid state.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a destination address that matches an address of the AP or that matches a wildcard address associated with the AP, irrespective of the source address included in the header of the data packet.

Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Abstract: A multi-chiplet assembly may include a first logic chiplet. A multi-chiplet assembly may include a memory chiplet electrically coupled to the first logic chiplet. A multi-chiplet assembly may include a second logic chiplet. A multi-chiplet assembly may include a bridging chiplet electrically coupling the first logic chiplet to the second logic chiplet. Various other apparatuses, systems, and methods are also disclosed.

Abstract: Various methods, apparatuses, and media for processing a transaction are provided. A request to process the transaction is received. The request includes a plurality of pieces of transaction data. An initial contract is identified, based on at least a first piece of the transaction data, and loaded. The initial contract includes a plurality of mono-services, with each of the mono-services being a function literal that includes a defined input and output and being configured to implement exactly one piece of functionality. The initial contract is executed, with the mono-services being configured to return a result for responding to the request to process the transaction.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a destination address that matches an address of the AP or that matches a wildcard address associated with the AP, irrespective of the source address included in the header of the data packet.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a source address that matches an address of an authenticated STA, irrespective of the destination address included in the header of the data packet.

Abstract: A system that includes a wettable thermal insulator, a phase change material, and a flexible pouch. In the event a thermal event occurs, the phase change material changes from a liquid state to a gaseous state. The flexible pouch is configured to envelope the wettable thermal insulator and the phase change material in the liquid state.

Abstract: ML methods and systems for cataloging and making recommendations based on domain-specific knowledge are disclosed. An example method includes: cataloging, using knowledge engines, data to develop knowledge repositories for respective domains; obtain current domain state data; obtain future domain state data; analyze, using first ML models, one or more of (i) data from the knowledge repositories, (ii) the first domain state data, and (iii) the second domain state data to identify a recommended set of one or more regulations, standards, policies and/or rules for a desired second domain state; analyze, using second ML models, (i) the recommended set and (ii) a current data and architecture state for a current computing environment to generate a summary of one or more cloud deployment options for migrating a current computing environment to a future computing environment for a future domain state; and cause the summary to be displayed on a computing device.

Abstract: A time-of-flight (ToF) module includes a light source, a driver module, and a light sensor. The driver module includes electrical circuitry configured to selectively drive the light source to emit pulsed illumination light. The light sensor is configured to sense returning light reflected from a target. At least one of the light source, driver module, and light sensor is stacked on another to reduce a footprint of the ToF module.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.

Abstract: A chip package and method for fabricating the same are provided that include hybrid bonded bridge dies connecting IC dies on adjacent die stacks. In one example, a chip package includes an interconnect routing structure, a first die stack and a second die stack. The first die stack includes a top die disposed over a bottom die, the bottom die stacked on the interconnect routing structure. The second die stack also includes a top die disposed over a bottom die, the bottom die stacked on the interconnect routing structure. The first bridge die is electrically and mechanically coupled to the top dies of the first and second die stacks. The first bridge die having solid state circuitry that connects circuitries of the top dies of the first and second die stacks.

Abstract: A power system includes an integrated energy storage system (ESS). It further includes a photovoltaic (PV) source. It further includes an integrated inverter having power connections to both the energy storage system and the photovoltaic source. The inverter includes an integrated PV disconnect switch.

Abstract: A data management server may receive data associated with a blockchain unit generated on a blockchain. The data received may include on-chain data and off-chain data. The data management server may create a data collection associated with the blockchain unit. The data collection may include the received data that is stored in one or more entries of transactions associated with the blockchain unit. One of the entries of transactions may include the on-chain data that is stored on the blockchain. The data management server may store, off-chain, the data collection associated with the blockchain unit. The data management server may generate an off-chain address for a user to retrieve the data collection. The off-chain address allows the user to review one of the entries of transactions off-chain.

Abstract: A system performs verification of Ethernet hardware. A data frame including a first portion for storing a checksum value and a second portion for storing a timestamp value is received. The second portion of data frame is set to zero. A timestamp value for including in second portion of the data frame is received. A modified checksum value is determined based on the checksum value included in the first portion of the data frame and the timestamp value. A cyclic redundancy check (CRC) value is determined for the data frame by nullifying the checksum value in the data frame and considering the timestamp value. A final CRC value is determined by combining the CRC value for the data frame and a CRC correction value based on the checksum. The modified data frame is sent for processing using an emulator.

Abstract: A system that includes a wettable thermal insulator, a phase change material, and a flexible pouch. In the event a thermal event occurs, the phase change material changes from a liquid state to a gaseous state. The flexible pouch is configured to envelope the wettable thermal insulator and the phase change material in the liquid state.

Abstract: A method for automatically recommending to a user of a software application one or more categories of a plurality of different categories of tax deductible expenses includes providing input data to a trained machine learning model and receiving output from the trained machine learning model based on the input data. The output includes a recommendation for the user that includes (i) one or more categories of the plurality of different categories of tax deductible expenses; and (ii) a plurality of examples of tax deductible expenses for each of the one or more categories. The method includes receiving feedback from the user on the recommendation and generating updated training data for the trained machine learning model based on the feedback.

Abstract: In some embodiments, techniques for creating fabricable segmented designs for physical devices are provided. A proposed segmented design is determined based on a design specification. The proposed segmented design includes a plurality of segments that each includes an indication of a material for the segment. The proposed segmented design also includes lattice members and lattice voids. A size of the lattice members and a size of the lattice voids are greater than a size of the segments and are greater than or equal to at least one of a minimum feature width and a minimum feature spacing of a fabrication system Performance of the proposed segmented design is simulated. One or more lattice members and lattice voids are chosen to change to improve the performance of the proposed segmented design.