Sensor housing
Latest TDK CORPORATION Patents:
1. Sensor housing
The present article is a compact sensor housing that is attached to a target factory equipment and is used for predictive maintenance thereof; the article contains a vibration sensor, an acceleration sensor, a temperature and humidity sensor, or the like therein for sensing a condition of the equipment and has a wireless communication function; the broken lines depict portions of the article that form no part of the claimed designs; the substantially triangular shaped portion in the reproductions
Claims
The ornamental design for a sensor housing as shown and described.
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- I3 Micro Module—Predicting Anomalies Before Breakdowns Occur, release date on tdk.com of Jun. 30, 2022 [online], [site visited Mar. 18, 2025], Available from the internet URL: https://www.tdk.com/en/featured_stories/entry_046-sensor-micro-module.html (Year: 2022).
Type: Grant
Filed: Jun 13, 2023
Date of Patent: Feb 17, 2026
Assignee: TDK CORPORATION (Tokyo)
Inventors: Yuki Asazuma (Tokyo), Naotsugu Ueda (Tokyo), Michihiro Muramoto (Tokyo), Yasushi Itobata (Tokyo), Kenichi Fukushi (Tokyo), Yoichi Kitamura (Tokyo)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Lillian Embrey
Application Number: 35/521,241