Bone conduction earphone

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Description

FIG. 1 is a front, right and top perspective view of a bone conduction earphone, showing my new design.

FIG. 2 is a rear, left and bottom perspective view thereof.

FIG. 3 is a front elevation view thereof.

FIG. 4 is a rear elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a right side elevation view thereof.

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The dashed broken lines depict portions of the bone conduction earphone that form no part of the claimed design.

Claims

The ornamental design for a bone conduction earphone as shown and described.

Referenced Cited
U.S. Patent Documents
D915345 April 6, 2021 Zhang
D955364 June 21, 2022 Wu
D996391 August 22, 2023 Zhang
D1002574 October 24, 2023 Ho
D1016781 March 5, 2024 Tan
D1025006 April 30, 2024 Wu
D1042847 September 17, 2024 Wu
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D1049074 October 29, 2024 Li
D1063076 February 18, 2025 Huang
D1073952 May 6, 2025 Huang
D1076873 May 27, 2025 Deng
D1091510 September 2, 2025 Zhang
D1093338 September 16, 2025 Tang
D1103143 November 25, 2025 Zhong
D1103144 November 25, 2025 Zhong
D1103145 November 25, 2025 Zhong
D1103146 November 25, 2025 Zhong
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Other references
  • Bone Conduction Headphones, date first available: Nov. 21, 2025, [retrieved Dec. 9, 2025], Retrieved from Internet, URL: <https://www.amazon.com/dp/B0G39663FB> (Year: 2025).
  • Pearl Finish Swimming Headphones, date first available: Jun. 17, 2025, [retrieved Dec. 9, 2025], Retrieved from Internet, URL: <https://www.amazon.com/dp/B0FDGNK9N5?th=1> (Year: 2025).
  • Raycon Bone Conduction Headphones, date first available: Jan. 22, 2025, [retrieved Dec. 9, 2025], Retrieved from Internet, URL: <https://www.amazon.com/dp/B0DTRW94T7?th=1> (Year: 2025).
  • Bone Conduction Headphones, date first available: Aug. 22, 2019, [retrieved Dec. 9, 2025], Retrieved from Internet, URL: <https://www.amazon.com/EKEN-Bone-Conduction-Headphones-Lightweight/dp/B07WSX2168?th=1> (Year: 2019).
Patent History
Patent number: D1122908
Type: Grant
Filed: Mar 28, 2025
Date of Patent: Apr 21, 2026
Assignee: Shenzhen Siweier Technology Co., Ltd (Shenzhen)
Inventor: Binglan Tang (Ganzhou)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/995,775
Classifications
Current U.S. Class: Headphone (D14/223)