Bone conduction earphone
Description
The dashed broken lines depict portions of the bone conduction earphone that form no part of the claimed design.
Claims
The ornamental design for a bone conduction earphone as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1122908
Type: Grant
Filed: Mar 28, 2025
Date of Patent: Apr 21, 2026
Assignee: Shenzhen Siweier Technology Co., Ltd (Shenzhen)
Inventor: Binglan Tang (Ganzhou)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/995,775
Type: Grant
Filed: Mar 28, 2025
Date of Patent: Apr 21, 2026
Assignee: Shenzhen Siweier Technology Co., Ltd (Shenzhen)
Inventor: Binglan Tang (Ganzhou)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/995,775
Classifications
Current U.S. Class:
Headphone (D14/223)