Array microphone

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Description

FIG. 1 is a front perspective view of an array microphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a partial enlarged view taken from circle 8 in FIG. 1; and,

FIG. 9 is a partial enlarged view taken from circle 9 in FIG. 2.

The broken lines in the drawings illustrate portions of the array microphone that form no part of the claimed design.

The dot-dash-dot broken lines shown in FIGS. 1 and 2 indicates the boundary of the enlarged view illustrated in FIGS. 8 and 9 and forms no part of the claimed design.

Claims

The ornamental design for an array microphone, as shown and described.

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  • “Audioxpress Sennheiser Launches TeamConnect Ceiling Medium Microphone Array” Feb. 13, 2023, audioxpress, site visited Nov. 14, 2025: https://audioxpress.com/news/sennheiser-announces-teamconnect-ceiling-medium-microphone-array (Year: 2023).
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Patent History
Patent number: D1122909
Type: Grant
Filed: Jan 15, 2025
Date of Patent: Apr 21, 2026
Assignee: AI SPEECH CO., LTD. (Suzhou)
Inventors: Sen Wang (Suzhou), Huabing Zhang (Suzhou), Kai Guo (Suzhou)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/984,807
Classifications