Probe pin for integrated circuits testing

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Description

1.1: Perspective

1.2: Front

1.3: Back

1.4: Left

1.5: Right

1.6: Top

1.7: Bottom

The material of the design is metal; This design is a probe pin that contacts the electrodes, terminals, pads, etc. of the subject, and is used to inspect electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards; The shape of our new design has an integrated body and is in the form of a coil spring for compression recovery; Crown-shaped contact terminals are formed on both sides; Powder and elastic material for electrical conductivity and elastic resilience are mixed inside the coil spring-shaped integrated body; The main point of the design is the shape of the “Probe pin for integrated circuits testing”.

Claims

The ornamental design for a probe pin for integrated circuits testing as shown and described.

Referenced Cited
U.S. Patent Documents
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20200393494 December 17, 2020 Shin
20210231706 July 29, 2021 Pak
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20250052782 February 13, 2025 Takahashi
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Foreign Patent Documents
3020230043802M001 November 2023 KR
113302006 May 2024 TW
113302007 May 2024 TW
DM/244792 July 2024 WO
Other references
  • Smiths Interconnect, H-Pin Stamped Contact, Date first available Apr. 12, 2024, retrieved Mar. 4, 2026, available from https://www.smithsinterconnect.com/getattachment/fe348743-f1ec-476c-97e4-1ed03e4bae5f/H-Pin-Data-Sheet-(US).pdf (Year: 2024).
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Patent History
Patent number: D1127608
Type: Grant
Filed: May 3, 2024
Date of Patent: May 26, 2026
Inventors: Dong Weon Hwang (Seongnam-si), Jae Baek Hwang (Seongnam-si), Logan Jae Hwang (Beverly Hills, CA)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Sarah S Sahneh
Application Number: 35/525,028