Breadboard
Description
The broken lines in the drawings depict portions of the breadboard that form no part of the claimed design.
Claims
The ornamental design for a breadboard, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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| D374866 | October 22, 1996 | Johnston |
| D430856 | September 12, 2000 | Wilkerson |
| D459706 | July 2, 2002 | Ebihara |
| D505925 | June 7, 2005 | Koo |
| D629383 | December 21, 2010 | Quilter |
| D647072 | October 18, 2011 | Bentley |
| D745476 | December 15, 2015 | Ronse |
| D847103 | April 30, 2019 | Sawada |
| D1012050 | January 23, 2024 | Adams |
| D1077763 | June 3, 2025 | Lyu |
| 20070111573 | May 17, 2007 | Seymour |
| 20160109479 | April 21, 2016 | Alhalabi |
- MDPI, date referenced: Apr. 27, 2025, data retrieved by Bryan Melvin on Aug. 5, 2025 at: https://www.mdpi.com/2673-4591/92/1/24 (Year: 2025).
Patent History
Patent number: D1127746
Type: Grant
Filed: Mar 17, 2022
Date of Patent: May 26, 2026
Assignee: HUAIAN MEIXIN MECHANICAL AND ELECTRICAL CO. LTD (Huaian City)
Inventor: Pengjie Zhang (Huaian)
Primary Examiner: Michelle E. Wilson
Assistant Examiner: Bryan N. Melvin
Application Number: 29/831,025
Type: Grant
Filed: Mar 17, 2022
Date of Patent: May 26, 2026
Assignee: HUAIAN MEIXIN MECHANICAL AND ELECTRICAL CO. LTD (Huaian City)
Inventor: Pengjie Zhang (Huaian)
Primary Examiner: Michelle E. Wilson
Assistant Examiner: Bryan N. Melvin
Application Number: 29/831,025
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)