Heat sink structure

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Description

FIG. 1 is a perspective view of heat sink structure showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a view showing the status of use thereof.

The broken lines depict portions of the heat sink structure and form no part of the claimed design.

Claims

The ornamental design for a heat sink structure, as shown and described.

Referenced Cited
U.S. Patent Documents
D398978 September 29, 1998 Horng
D673514 January 1, 2013 Guo
D829183 September 25, 2018 Li
D977488 February 7, 2023 Lin
D997109 August 29, 2023 Tso
20070133178 June 14, 2007 Han
20180203493 July 19, 2018 Han
20180295746 October 11, 2018 Han
20180341300 November 29, 2018 Han
20210373629 December 2, 2021 Han
20230171914 June 1, 2023 Lin
20240369075 November 7, 2024 Liang
20250251125 August 7, 2025 Zheng
Foreign Patent Documents
202230750659.4 March 2023 CN
112303107 February 2024 TW
Other references
  • ASUS CPU Cooler. Found online Sep. 3, 2025 at amazon.com. Reference dated Jun. 19, 2023. Retrieved from https://www.amazon.com/dp/B0C8BVRYB5/?th=1 (Year: 2023).
  • Lian Li Hydroshift CPU Cooler. Found online Sep. 3, 2025 at amazon.com. Reference dated May 28, 2025. Retrieved from https://www.amazon.com/dp/B0F1MH466S?th=1 (Year: 2025).
Patent History
Patent number: D1129394
Type: Grant
Filed: Apr 3, 2024
Date of Patent: Jun 9, 2026
Inventor: Chien-Hao Chen (Keehung City)
Primary Examiner: Amanda Christensen
Application Number: 29/935,812
Classifications
Current U.S. Class: Heat Sink (D13/179)