Shock-absorbing material for packaging

- CJ Logistics Corporation
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Description

1.1: Perspective

1.2: Front

1.3: Back

1.4: Left

1.5: Right

1.6: Top

1.7: Bottom

Claims

The ornamental design for a shock-absorbing material for packaging as shown and described.

Referenced Cited
U.S. Patent Documents
D228882 October 1973 Bish
4148428 April 10, 1979 Gardner
D270346 August 30, 1983 Smith
D339745 September 28, 1993 Duell
D523610 June 20, 2006 Kissell
D668952 October 16, 2012 Auclair
D730749 June 2, 2015 Young
D796954 September 12, 2017 Lun
D820087 June 12, 2018 Kelley
D881011 April 14, 2020 Wolf
D997741 September 5, 2023 Chen
Patent History
Patent number: D1133908
Type: Grant
Filed: Feb 11, 2025
Date of Patent: Jul 14, 2026
Assignee: CJ Logistics Corporation (Seoul)
Inventors: Soo Hyung Lee (Seoul), Ju Hwan Yoo (Seoul), Hye Yeon Jeong (Seoul), Ja Hyun Koo (Seoul), Oh Sung Kwon (Seoul), Jung Hoon Park (Seoul), Hyun Woo Yang (Seoul), Yu Mi Jeong (Seoul), Chan Woo Kim (Seoul)
Primary Examiner: Darcey E Gottschalk
Application Number: 35/524,909
Classifications
Current U.S. Class: D9/456