Headphone

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Description

FIG. 1 is a front and left perspective view of a headphone, showing my new design;

FIG. 2 is a rear, right and top perspective view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines shown in the drawings illustrate portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

Referenced Cited
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Other references
  • Shokz, “New Open Run . . . ”, available at amazon.com, date first available May 24, 2024, site visited Mar. 19, 2026, available at URL: https://a.co/d/0i18vv5X (Year: 2024).
  • Sanoto Store, “Bone Conduction Headphones . . . ”, available at amazon.com, date first available Sep. 16, 2025, site visited Mar. 19, 2026, available at URL: https://a.co/d/0hZFYWeh (Year: 2025).
  • Enerair, “Bone Conduction Headphones . . . ”, available at amazon.com, date first available Jun. 19, 2023, site visited Mar. 19, 2026, available at URL: https://a.co/d/0iFSE92E (Year: 2023).
Patent History
Patent number: D1134293
Type: Grant
Filed: Jul 17, 2025
Date of Patent: Jul 14, 2026
Inventor: Wei Zhang (Xinyi)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 30/013,608
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)