Semiconductor module

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Description

1.1 Perspective

1.2 Perspective

1.3 Front

1.4 Back

1.5 Left

1.6 Right

1.7 Top

1.8 Bottom

Claims

The ornamental design for a semiconductor module as shown and described.

Referenced Cited
U.S. Patent Documents
6061160 May 9, 2000 Maruyama
D491899 June 22, 2004 Yagi
D495304 August 31, 2004 Kim
D576966 September 16, 2008 Ng
D595244 June 30, 2009 In
D596591 July 21, 2009 In
D611011 March 2, 2010 Ariizumi
D621801 August 17, 2010 Hsieh
D626095 October 26, 2010 Hsieh
D627311 November 16, 2010 Lai
D628541 December 7, 2010 Lin
D780120 February 28, 2017 Tahara
20130134454 May 30, 2013 Chan
Other references
  • Shindengen, date referenced: Nov. 28, 2025, data retrieved by Bryan Melvin on Mar. 10, 2026 at: https://www.shindengen.com/products/new/2025/202512_cg.html (Year: 2025).
Patent History
Patent number: D1139186
Type: Grant
Filed: Jul 17, 2024
Date of Patent: Aug 4, 2026
Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. (Tokyo)
Inventors: Yoshimasa Kobayashi (Asaka City), Yasuhiro Imazeki (Asaka City)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Bryan N. Melvin
Application Number: 35/525,890