Pad for wearable robot
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Description
Claims
The ornamental design for a pad for wearable robot, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1141138
Type: Grant
Filed: Jan 22, 2025
Date of Patent: Aug 11, 2026
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Jihye Lee (Suwon-si), Hongkue Lee (Suwon-si), Jiyun Park (Suwon-si), Jong-Deuk Son (Suwon-si)
Primary Examiner: Jennifer L Watkins
Application Number: 29/987,258
Type: Grant
Filed: Jan 22, 2025
Date of Patent: Aug 11, 2026
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Jihye Lee (Suwon-si), Hongkue Lee (Suwon-si), Jiyun Park (Suwon-si), Jong-Deuk Son (Suwon-si)
Primary Examiner: Jennifer L Watkins
Application Number: 29/987,258
Classifications
Current U.S. Class:
Body Attached Restraint, Support Or Guard (e.g., Cast, Sling, Orthotic Device, Etc.) (54) (D24/190);
D6/601