Device for measuring package dimensions

Info

Patent number: D1156222
Type: Grant
Filed: May 22, 2024
Date of Patent: Nov 3, 2026
Assignee: Pitney Bowes, Inc. (Shelton, CT)
Inventors: Daisuke Sawaki (Bridgeport, CT), Abhay Raj Singh (Orange, CT), Surya R. Sagi (Southbury, CT)
Primary Examiner: Sandra Snapp
Assistant Examiner: Antoinette Martine Suiter
Application Number: 29/943,528

Description

Description

FIG. 1 is a top, front and right side perspective view of a device for measuring package dimensions according to the present invention;

FIG. 2 is a is a front view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a bottom view thereof.

Claims

The ornamental design for a device for measuring package dimensions as shown and described.