Suture package

- Ethicon, Inc.
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Description

FIG. 1 is a top plan view of a suture package showing our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a side elevational view;

FIG. 4 is a perspective view;

FIG. 5 is a perspective view showing a modified form of our new design; and

FIG. 6 is a perspective view showing another modified form of our new design.

Referenced Cited
U.S. Patent Documents
D197145 December 1963 Sanders
3136418 June 1964 Stacy et al.
3363751 January 1968 Shave et al.
3398825 August 1968 Flook, Jr. et al.
3939969 February 24, 1976 Miller et al.
Patent History
Patent number: D245069
Type: Grant
Filed: Oct 20, 1975
Date of Patent: Jul 19, 1977
Assignee: Ethicon, Inc. (Somerville, NJ)
Inventors: Harvey B. Mandel (N. Brunswick, NJ), Michael Schuler (Edison, NJ)
Primary Examiner: Robert C. Spangler
Attorney: Wayne R. Eberhardt
Application Number: 5/623,862
Classifications
Current U.S. Class: D/9193
International Classification: D0903;