Overpressure device

- Cutter Laboratories, Inc.
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Description

FIG. 1 is a side elevational view of an overpressure device showing our new design;

FIG. 2 is a front elevational view taken along line 2--2 of FIG. 1;

FIG. 3 is a rear elevational view taken along line 3--3 of FIG. 1;

FIG. 4 is a top plan view taken along line 4--4 of FIG. 1; and

FIG. 5 is a bottom plan view taken along line 5--5 of FIG. 1.

Referenced Cited
U.S. Patent Documents
D235926 July 1975 Olson
D236163 July 1975 Manno
4043332 August 23, 1977 Metcalf
4095658 June 20, 1978 Kendall et al.
4135509 January 23, 1979 Shannon
Patent History
Patent number: D260427
Type: Grant
Filed: Mar 26, 1979
Date of Patent: Aug 25, 1981
Assignee: Cutter Laboratories, Inc. (Berkeley, CA)
Inventors: Lee E. McGill (Orinda, CA), Susan J. Watkins (Berkeley, CA)
Primary Examiner: Bernard Ansher
Attorneys: Robert E. Allen, Bertram Bradley, James A. Giblin
Application Number: 6/23,926
Classifications
Current U.S. Class: D24/8; D24/17
International Classification: D2401; D2402;