Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
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Description
FIG. 1 is a top plan view of a heat sink or similar article showing our new design, the bottom plan view being substantially identical thereto; and
FIG. 2 is a side elevational view of the heat sink or similar article of our invention.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
| 2879977 | March 1959 | Trought |
| 3033537 | May 1962 | Brown, Jr. |
| 1407201 | September 1975 | GBX |
Patent History
Patent number: D268667
Type: Grant
Filed: May 28, 1981
Date of Patent: Apr 19, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/264,936
Type: Grant
Filed: May 28, 1981
Date of Patent: Apr 19, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/264,936
Classifications
Current U.S. Class:
D13/23
International Classification: D1303;
International Classification: D1303;
