Abstract: A torque device can provide more control of the guidewire with less user effort. The torque device may include a first member, a second member, and a connecting member that couples the first member and the second member; and a locking member slidably coupled to the first member and/or the second member. The locking member may be configured to move along at least a portion of a side of the first member and the second member between one or more positions corresponding to operation states. The operation states may include a closed state in which the side of the first member and of the second member are fixedly secured with respect to the locking member, and one or more open states in which at least a portion of the side of first member and at least a portion of the side of the second member are separated.

Abstract: A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.

Abstract: A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.

Abstract: Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0.degree. C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6.degree. C. in.sup.3 /W.

Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.

Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.

Abstract: A lock device for locking a sliding member relative to a stationary member, the sliding and stationary members including frames, the device includes a bracket for attaching to the frame of the sliding member. The bracket includes a first member secured to the bracket and a second member rotatably connected to the first member. The second member includes a locking mechanism for securing the second member to the first member. A bar member is also included and has one end adapted to be supported by the first member and to be secured in place by the second member when the locking mechanism secures the second member to the first member. The bar member extends outwardly from the bracket to the frame of the stationary member to prevent sliding movement of the sliding member.

Abstract: Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.

Abstract: A strip material (18) for forming an inductive loop (10) adapted to be applied to the surface of a roadway (12). The strip material (18) consists of and the loop (10) is formed from a ductile, flexible, flattened, extensible conductor (20) and a protective covering (22). A protective underlayment (24) is optional. The conductor (20) may be formed from a compressed, flattened metallic wire braid (28) or from a wire mesh containing 25% to 75% voids. The protective covering (22) may be formed from either combination unvulcanized elastomer precursor base sheet (30) and a vinyl based polymer support film (32), or a covering (26) selected from the group of epoxy, polyester, urethane and polyurethane.

Abstract: Alignment apparatus for receiving, aligning and retaining the pin connectors of an electronic component package in predetermined relationship is used to maintain proper alignment of the pin connectors with preformed holes or mounting pads on a printed circuit board or the like when the sub-assembly of a heat sink and an electronic component package is mounted on a printed circuit board or the like.

Abstract: Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment apparatus includes means for securing the electronic device package in intimate thermal contact with the heat sink for rapid dissipation of heat therefrom.

Abstract: A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.

Abstract: Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

Abstract: Disclosed is means for mounting semiconductor device cases on mounting substrates such as circuit boards. The mounting means includes studs passing transversely through the body of the mounting means for mounting a semiconductor case or semiconductor case and heat sink on one side of the body. The opposite ends of the studs are coated with a solder-promoting material so that the studs may be soldered directly to the circuit board. The body may include electrically conductive pin receptacles for mating with pins extending from the semiconductor case. The pin receptacles have solderable shanks extending from the opposite side of the socket body. Stand-off bosses are also disclosed for spacing the mounting body from the surface of the circuit board and for spacing the heat sink from the surface of the mounting body.

Abstract: Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.