Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
- Heat dissipation system having releasable attachment assembly
- Heat sink mounting assembly for surface mount electronic device packages
- Apparatus for securing electronic device packages to heat sinks
- Spring clip fastener for surface mounting of printed circuit board components
Description
FIG. 1 is a bottom plan view of the heat sink or similar article showing our new design;
FIG. 2 is an end elevational view thereof as seen from the top of FIG. 4;
FIG. 3 is a side elevational view thereof as seen from the right of FIG. 4;
FIG. 4 is a top plan view thereof;
FIG. 5 is a side elevational view thereof as seen from the left of FIG. 4; and
FIG. 6 is an end elevational view thereof as seen from the bottom of FIG. 4 .
Referenced Cited
U.S. Patent Documents
Other references
3151308 | September 1964 | Root |
3407868 | October 1968 | Coe |
3893161 | July 1975 | Pesak, Jr. |
4054901 | October 18, 1977 | Edwards et al. |
- Amperex Transistor Brochure, 6-1966, Dual Heat Sink Clip.
Patent History
Patent number: D269606
Type: Grant
Filed: May 26, 1981
Date of Patent: Jul 5, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Howard G. Hinshaw (Dallas, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/267,359
Type: Grant
Filed: May 26, 1981
Date of Patent: Jul 5, 1983
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Howard G. Hinshaw (Dallas, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz & Timmons
Application Number: 6/267,359
Classifications
Current U.S. Class:
D13/23
International Classification: D1303;
International Classification: D1303;