Integrated circuit device
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Description
FIG. 1 is a bottom plan view of an integrated circuit device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a perspective view thereof; and
FIG. 8 is a sectional view taken along line A--A of FIG. 2.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| D236833 | September 1975 | Beall |
| 2879977 | March 1959 | Trought |
| 3241605 | March 1966 | Tabor |
| 3808475 | April 1974 | Buelow et al. |
| 3872583 | March 1975 | Beall et al. |
| 2091036 | January 1981 | GBX |
- Electronic Design, May 1959, FIG. 1-cutaway of heat exchanger. IBM Technical Disclosure, vol. 23, No. 9, Feb. 1981, center post heat sink; Nutter et al.
Patent History
Patent number: D276719
Type: Grant
Filed: Jul 12, 1982
Date of Patent: Dec 11, 1984
Assignee: Fujitsu Limited (Kawasaki)
Inventors: Masahiro Sugimoto (Yokosuka), Hidehiko Akasaki (Kawasaki), Tetsushi Wakabayashi (Yokohama)
Primary Examiner: Catherine E. Kemper
Assistant Examiner: Clare E. Heflin
Law Firm: Staas & Halsey
Application Number: 6/397,051
Type: Grant
Filed: Jul 12, 1982
Date of Patent: Dec 11, 1984
Assignee: Fujitsu Limited (Kawasaki)
Inventors: Masahiro Sugimoto (Yokosuka), Hidehiko Akasaki (Kawasaki), Tetsushi Wakabayashi (Yokohama)
Primary Examiner: Catherine E. Kemper
Assistant Examiner: Clare E. Heflin
Law Firm: Staas & Halsey
Application Number: 6/397,051
Classifications
Current U.S. Class:
D13/99;
D13/23