Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
- Heat dissipation system having releasable attachment assembly
- Heat sink mounting assembly for surface mount electronic device packages
- Apparatus for securing electronic device packages to heat sinks
- Spring clip fastener for surface mounting of printed circuit board components
Description
FIG. 1 is a perspective view of a heat sink or similar article showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 and FIG. 5 are opposite end elevational views thereof;
FIG. 4 and FIG. 6 are opposite side elevational views thereof; and
FIG. 7 is a bottom plan view thereof.
Referenced Cited
Patent History
Patent number: D300738
Type: Grant
Filed: Nov 16, 1987
Date of Patent: Apr 18, 1989
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Donald L. Bland (Ft. Worth, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz, Scherback & Timmons
Application Number: 7/120,804
Type: Grant
Filed: Nov 16, 1987
Date of Patent: Apr 18, 1989
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventors: William D. Jordan (Dallas, TX), Donald L. Bland (Ft. Worth, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz, Scherback & Timmons
Application Number: 7/120,804
Classifications
Current U.S. Class:
D13/23