Semiconductor substrate with conducting pattern
Latest Ibiden Co., Ltd. Patents:
Description
FIG. 1 is a top perspective view of a semi-conductor mounting device showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof;
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D319629
Type: Grant
Filed: Apr 13, 1988
Date of Patent: Sep 3, 1991
Assignee: Ibiden Co., Ltd. (Ogaki)
Inventors: Terutomi Hasegawa (Ogaki), Nobumichi Goto (Seki)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Joel Sincavage
Law Firm: Lorusso & Loud
Application Number: 7/181,253
Type: Grant
Filed: Apr 13, 1988
Date of Patent: Sep 3, 1991
Assignee: Ibiden Co., Ltd. (Ogaki)
Inventors: Terutomi Hasegawa (Ogaki), Nobumichi Goto (Seki)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Joel Sincavage
Law Firm: Lorusso & Loud
Application Number: 7/181,253
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)