Heat insulating cylinder for thermal treatment of semiconductor wafers
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Description
FIG. 1 is a front elevational view of a heat insulating cylinder for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 3 is a top plan view;
FIG. 4 is a bottom plan view; and,
FIG. 5 is a rear elevational view thereof.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D215093 | September 1969 | Cone |
D234847 | April 1975 | Hoffman |
D258526 | March 10, 1981 | Nederman |
3604694 | September 1971 | Muller |
3737282 | June 1973 | Hearn et al. |
3744650 | July 1973 | Henebry et al. |
4761134 | August 2, 1988 | Foster |
4849608 | July 18, 1989 | Muraoka et al. |
17213 | 1888 | GBX |
Patent History
Patent number: D326273
Type: Grant
Filed: Jan 25, 1989
Date of Patent: May 19, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Ken Nakao (Sagamihara), Seishiro Sato (Machida), Wataru Ohkase (Sagamihara)
Primary Examiner: Donald P. Walsh
Assistant Examiner: Antoine D. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,997
Type: Grant
Filed: Jan 25, 1989
Date of Patent: May 19, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Ken Nakao (Sagamihara), Seishiro Sato (Machida), Wataru Ohkase (Sagamihara)
Primary Examiner: Donald P. Walsh
Assistant Examiner: Antoine D. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,997
Classifications
Current U.S. Class:
D15/1441