Instrument for transferring boats for thermal treatment of semiconductor wafers
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Description
FIG. 1 is a front elevational view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is an elevational view, the remainder of the cylindrical member being the same throughout in appearance;
FIG. 3 is a top plan view;
FIG. 4 is a bottom plan view;
FIG. 5 is an elevational view thereof;
FIG. 6 is a top perspective view; and,
FIG. 7 is a bottom perspective view thereof.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D150358 | July 1948 | Hobart et al. |
3604694 | September 1971 | Muller |
3737282 | June 1973 | Hearn et al. |
3744650 | July 1973 | Henebry et al. |
4761134 | August 2, 1988 | Foster |
17213 | 1888 | GBX |
Patent History
Patent number: D327078
Type: Grant
Filed: Jan 25, 1989
Date of Patent: Jun 16, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Ken Nakao (Sagamihara), Seishiro Sato (Machida), Wataru Ohkase (Sagamihara)
Primary Examiner: Donald P. Walsh
Assistant Examiner: Antoine O. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,994
Type: Grant
Filed: Jan 25, 1989
Date of Patent: Jun 16, 1992
Assignee: Tel Sagami Limited (Kanagawa)
Inventors: Ken Nakao (Sagamihara), Seishiro Sato (Machida), Wataru Ohkase (Sagamihara)
Primary Examiner: Donald P. Walsh
Assistant Examiner: Antoine O. Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/301,994
Classifications
Current U.S. Class:
Heat Treatment, Welding Or Brazing (D15/144)