Film laminator for printed circuit boards

- Somar Corporation
Description

FIG. 1 is a front elevational view of a film laminator for printed circuit boards showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a front, top and right side perspective view thereof.

Referenced Cited
U.S. Patent Documents
D328307 July 28, 1992 Belletire et al.
4418511 December 6, 1983 Collin
4545175 October 8, 1985 Beckett
4545176 October 8, 1985 Marchetti
4832774 May 23, 1989 DiFrank et al.
5106450 April 21, 1992 Freisitzer et al.
Patent History
Patent number: D338025
Type: Grant
Filed: Sep 26, 1990
Date of Patent: Aug 3, 1993
Assignee: Somar Corporation (Tokyo)
Inventors: Yoji Washizaki (Saitama), Akira Igarashi (Tokyo)
Primary Examiner: Alan P. Douglas
Assistant Examiner: A. D. Davis
Law Firm: Sughrue, Mion, Zinn, Macpeak & Seas
Application Number: 7/589,474
Classifications
Current U.S. Class: Packaging Or Wrapping (D15/145)