Film laminator for printed circuit boards
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Description
FIG. 1 is a front elevational view of a film laminator for printed circuit boards showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a front, top and right side perspective view thereof.
Referenced Cited
Patent History
Patent number: D338025
Type: Grant
Filed: Sep 26, 1990
Date of Patent: Aug 3, 1993
Assignee: Somar Corporation (Tokyo)
Inventors: Yoji Washizaki (Saitama), Akira Igarashi (Tokyo)
Primary Examiner: Alan P. Douglas
Assistant Examiner: A. D. Davis
Law Firm: Sughrue, Mion, Zinn, Macpeak & Seas
Application Number: 7/589,474
Type: Grant
Filed: Sep 26, 1990
Date of Patent: Aug 3, 1993
Assignee: Somar Corporation (Tokyo)
Inventors: Yoji Washizaki (Saitama), Akira Igarashi (Tokyo)
Primary Examiner: Alan P. Douglas
Assistant Examiner: A. D. Davis
Law Firm: Sughrue, Mion, Zinn, Macpeak & Seas
Application Number: 7/589,474
Classifications
Current U.S. Class:
Packaging Or Wrapping (D15/145)