Supply nozzle for applying liquid resist to a semiconductor wafer
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Description
FIG. 1 is a top, front and left side perspective view of supply nozzle for applying liquid resist to a semiconductor wafer showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear being a mirror image;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view thereof taken on line 7--7 in FIG. 3; and,
FIG. 8 is a cross-sectional view thereof taken on line 8--8 in FIG. 2.
Referenced Cited
Patent History
Patent number: D341418
Type: Grant
Filed: Aug 21, 1991
Date of Patent: Nov 16, 1993
Assignees: Tokyo Electron Limited (Tokyo), Tokyo Electron Kyushu Limited (Kumamoto)
Inventor: Masami Akimoto (Kikuyo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: M. H. Tung
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/748,061
Type: Grant
Filed: Aug 21, 1991
Date of Patent: Nov 16, 1993
Assignees: Tokyo Electron Limited (Tokyo), Tokyo Electron Kyushu Limited (Kumamoto)
Inventor: Masami Akimoto (Kikuyo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: M. H. Tung
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/748,061
Classifications
Current U.S. Class:
Dispersal (i.e., Sprayer, Fogger, Nozzle, Aerator, Etc.) (4) (D23/213)