Supply nozzle for applying liquid resist to a semiconductor wafer

- Tokyo Electron Limited
Description

FIG. 1 is a top, front and left side perspective view of supply nozzle for applying liquid resist to a semiconductor wafer showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof, the rear being a mirror image;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view thereof taken on line 7--7 in FIG. 3; and,

FIG. 8 is a cross-sectional view thereof taken on line 8--8 in FIG. 2.

Referenced Cited
U.S. Patent Documents
D218239 August 1970 Stairs
D230641 May 1974 Moubray
D231098 April 1974 Pinke
3093316 June 1963 Hedeman
4907931 March 13, 1990 Mallory et al.
5002008 March 26, 1991 Ushijima et al.
5069591 December 3, 1991 Kinoshita
Patent History
Patent number: D341418
Type: Grant
Filed: Aug 21, 1991
Date of Patent: Nov 16, 1993
Assignees: Tokyo Electron Limited (Tokyo), Tokyo Electron Kyushu Limited (Kumamoto)
Inventor: Masami Akimoto (Kikuyo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: M. H. Tung
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 7/748,061