Heat dissipating device for a semiconductor package


FIG. 1 is a front view of an embodiment of the heat dissipating device;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;

FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,

FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design.

Referenced Cited
U.S. Patent Documents
4079410 March 14, 1978 Schierz
4268850 May 19, 1981 Lazarek et al.
4494171 January 15, 1985 Bland et al.
4546405 October 8, 1985 Hultmark et al.
4942497 July 17, 1990 Mine et al.
5113315 May 12, 1992 Capp et al.
Patent History
Patent number: D341820
Type: Grant
Filed: Aug 21, 1992
Date of Patent: Nov 30, 1993
Assignee: Itoh Research & Development Laboratory Co., Ltd. (Osaka)
Inventor: Satomi Itoh (Hyogo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: W. G. Fasse, D. H. Kane, Jr.
Application Number: 7/933,504
Current U.S. Class: Heat Sink (D13/179)