Heat dissipating device for a semiconductor package
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Description
FIG. 1 is a front view of an embodiment of the heat dissipating device;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a perspective view thereof;
FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;
FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,
FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design.
Referenced Cited
Patent History
Patent number: D341820
Type: Grant
Filed: Aug 21, 1992
Date of Patent: Nov 30, 1993
Assignee: Itoh Research & Development Laboratory Co., Ltd. (Osaka)
Inventor: Satomi Itoh (Hyogo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: W. G. Fasse, D. H. Kane, Jr.
Application Number: 7/933,504
Type: Grant
Filed: Aug 21, 1992
Date of Patent: Nov 30, 1993
Assignee: Itoh Research & Development Laboratory Co., Ltd. (Osaka)
Inventor: Satomi Itoh (Hyogo)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: W. G. Fasse, D. H. Kane, Jr.
Application Number: 7/933,504
Classifications
Current U.S. Class:
Heat Sink (D13/179)