Disc package for semiconductor wafers

- Empak, Inc.
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Description

FIG. 1 is a top front perspective view of a disc package for semiconductor wafers;

FIG. 2 is a front elevational view thereof, the undisclosed rear portion is a mirror image of the front;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a side elevation view thereof, the opposite side is a mirror image of the side shown.

Referenced Cited
U.S. Patent Documents
D260237 August 18, 1981 Fuzere
4588086 May 13, 1986 Coe
4793488 December 27, 1988 Mortensen
4966284 October 30, 1990 Gregerson et al.
Patent History
Patent number: D344891
Type: Grant
Filed: Feb 3, 1992
Date of Patent: Mar 8, 1994
Assignee: Empak, Inc. (Chanhassen, MN)
Inventor: Larry Dressen (Waconia, MN)
Primary Examiner: Bernard Ansher
Assistant Examiner: Richelle Shelton
Law Firm: Haugen and Nikolai
Application Number: 7/829,171
Classifications
Current U.S. Class: D/9424; 206/334; Closure Structure Specified For Stacking (206/508)