Heat dissipating device for a semiconductor package
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FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a perspective view thereof;
FIG. 7 is a sectional view taken along line 7--7 in FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design;
FIG. 8 shows the same side view as FIG. 5 with an attached semiconductor package shown in broken lines only since the semiconductor package does not form any part of the claimed design; and,
FIG. 9 is a top view in the direction of the arrow IX seen from a position perpendicular to the top surface of the heat dissipating device for a semiconductor package.
D276719 | December 11, 1984 | Sugimoto et al. |
3241605 | March 1966 | Tabor |
3406753 | October 1968 | Habdas |
3572428 | March 1971 | Monaco |
3589046 | May 1971 | Jordan |
3884293 | May 1975 | Pessolano et al. |
4292647 | September 29, 1981 | Lee |
4644385 | February 17, 1987 | Nakanishi et al. |
4716494 | December 29, 1987 | Bright et al. |
5087888 | February 11, 1992 | Mountz et al. |
5155579 | October 13, 1992 | Au Yeung |
0054597 | June 1982 | EPX |
- Air-cooled module on p. 1007 of IBM Technical Disclosure Bulletin vol. 20, No. 3 Aug. 1977. Heat removal module on p. 2249 of IBM Technical Disclosure Bulletin vol. 22 No. 6 Nov. 1979.
Type: Grant
Filed: Aug 21, 1992
Date of Patent: Mar 7, 1995
Assignee: Itoh Research & Development Laboratory Co., Ltd. (Osaka)
Inventor: Akira Itoh (Osaka)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: W. G. Fasse, W. F. Fasse
Application Number: 7/933,532