Facsimile
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Description
FIG. 1 is a perspective view of a facsimile showing my new design;
FIG. 2 is a perspective view thereof; with the cover shown in open position;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a left-side elevational view thereof; and,
FIG. 8 is a right-side elevational view thereof.
Referenced Cited
U.S. Patent Documents
Other references
| D331755 | December 15, 1992 | Hiroki et al. |
| D332259 | January 5, 1993 | Kashiwabara et al. |
| D361994 | September 5, 1995 | Sawada et al. |
| D363278 | October 17, 1995 | Kashiwabara et al. |
| D368709 | April 9, 1996 | Ishio |
| 4872061 | October 3, 1989 | Uchiyama |
| 5183431 | February 2, 1993 | Todokoro |
- Panafax, Jun. 1994. Radioshack, Aug. 1990, p. 4.
Patent History
Patent number: D376794
Type: Grant
Filed: Jan 16, 1996
Date of Patent: Dec 24, 1996
Assignee: Samsung Electronics Co., Ltd. (Suwon)
Inventor: Bong W. Lim (Kyungki-do)
Primary Examiner: Prabhakar G. Deshmukh
Law Firm: Flynn, Thiel, Boutell & Tanis, P.C.
Application Number: 0/49,637
Type: Grant
Filed: Jan 16, 1996
Date of Patent: Dec 24, 1996
Assignee: Samsung Electronics Co., Ltd. (Suwon)
Inventor: Bong W. Lim (Kyungki-do)
Primary Examiner: Prabhakar G. Deshmukh
Law Firm: Flynn, Thiel, Boutell & Tanis, P.C.
Application Number: 0/49,637
Classifications
Current U.S. Class:
D14/118