Heat dissipating plate for computer parts
Description
FIG. 1 is a top perspective view of a heat dissipating plate for computer parts showing the new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof; the rear view is identical;
FIG. 4 is a side elevational view thereof, the opposite side is identical; and,
FIG. 5 is a bottom plan view thereof.
Referenced Cited
U.S. Patent Documents
D366106 | January 9, 1996 | Yamamoto et al. |
5115579 | May 26, 1992 | AuYeung |
5208731 | May 4, 1993 | Blomquist |
5276585 | January 4, 1994 | Smithers |
5369301 | November 29, 1994 | Hayashi et al. |
5396402 | March 7, 1995 | Perugini et al. |
5421406 | June 6, 1995 | Furusawa et al. |
5435384 | July 25, 1995 | Wu |
5486981 | January 23, 1996 | Blomquist |
5581442 | December 3, 1996 | Morosas |
5594624 | January 14, 1997 | Clemens et al. |
5600540 | February 4, 1997 | Blomquist |
Patent History
Patent number: D398295
Type: Grant
Filed: Oct 8, 1996
Date of Patent: Sep 15, 1998
Inventor: Chih Pin Chang (Toukou Town, Yunlin Hsien)
Primary Examiner: M. H. Tung
Law Firm: Pro-Techtor International
Application Number: 0/60,834
Type: Grant
Filed: Oct 8, 1996
Date of Patent: Sep 15, 1998
Inventor: Chih Pin Chang (Toukou Town, Yunlin Hsien)
Primary Examiner: M. H. Tung
Law Firm: Pro-Techtor International
Application Number: 0/60,834
Classifications
Current U.S. Class:
D14/114
International Classification: 1402;
International Classification: 1402;