Processor package

- Intel
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Description

FIG. 1 is a perspective view of a processor package including an indented area on a surface;

FIGS. 2-4 are front, top, and back side views, respectively, of the processor package;

FIGS. 5-7 are right, left, and bottom views respectively of the processor package; and,

FIG. 8 is a cross sectional view of the processor package taken along line 8--8 in FIG. 2.

The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.

Referenced Cited
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Patent History
Patent number: D398592
Type: Grant
Filed: Nov 8, 1996
Date of Patent: Sep 22, 1998
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: Freda Nunn
Law Firm: Blakely, Sokoloff, Taylor & Zafman
Application Number: 0/62,138
Classifications
Current U.S. Class: D14/114; D14/117
International Classification: 1402;