Processing tube for use in a semiconductor wafer heat processing apparatus

- Tokyo Electron Limited
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Description

FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a cross sectional view thereof taken along line V-V in FIG. 2;

FIG. 6 a right side view thereof;

FIG. 7 a rear elevational view thereof;

FIG. 8 a left side view thereof;

FIG. 9 a cross sectional view thereof taken along line IX-IX in FIG. 3;

FIG. 10 a cross sectional view thereof taken along line X-X in FIG. 3; and,

FIG. 11 a reference figure showing the using state.

Referenced Cited
U.S. Patent Documents
4587689 May 13, 1986 Lee
5046909 September 10, 1991 Murdoch
5314574 May 24, 1994 Takahashi
5320218 June 14, 1994 Yamashita et al.
5407449 April 18, 1995 Zinger
5516732 May 14, 1996 Flegal
5518360 May 21, 1996 Toda et al.
5536128 July 16, 1996 Shimoyashiro et al.
5658115 August 19, 1997 Yamazaki et al.
5752796 May 19, 1998 Muka
Patent History
Patent number: D405429
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Feb 9, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventors: Tetsuya Hanagata (Tokyo), Shingo Watanabe (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,297
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;