Processor package cover plate

- Intel
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Description

FIG. 1 is a perspective view of a processor package cover plate on a processor package including an indented area on the surface of the processor package cover plate;

FIG. 2-4 are front, top, and back views, respectively, of the processor package cover plate on the processor package;

FIG. 5-7 are right, left, and bottom views, respectively, of the processor package cover plate on the processor package; and,

FIG. 8 is a cross sectional view of the processor package cover plate on the processor package taken along line 8--8 of FIG. 2.

The processor package is shown in broken lines in the views for illustrative purposes only and forms no part of the claimed design.

Referenced Cited
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Patent History
Patent number: D413109
Type: Grant
Filed: Nov 15, 1996
Date of Patent: Aug 24, 1999
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: Freda Nunn
Law Firm: Blakely, Sokoloff, Taylor & Zafman
Application Number: 0/62,471
Classifications
Current U.S. Class: D14/114; D14/107; D14/117
International Classification: 1402;