Processor package cover plate for an integrated circuit processor package chipset

- Intel
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Description

FIG. 1 is a perspective view of a cover plate on a processor package including an indented area on a surface of the cover plate.

FIG. 2 is a front view thereof.

FIG. 3 is a top view thereof.

FIG. 4 is a back view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a left side view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken on line 8--8 of FIG. 2.

The broken line drawing in FIGS. 1, 3, and 5-8 of the processor package is for illustrative purposes only and forms no part of the claimed design.

Referenced Cited
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Patent History
Patent number: D413315
Type: Grant
Filed: Dec 22, 1997
Date of Patent: Aug 31, 1999
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Law Firm: Blakely, Sokoloff, Taylor & Zafman
Application Number: 0/81,114
Classifications
Current U.S. Class: D14/114
International Classification: 1402;