Housing for electronic components

- Next Level Communications
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Description

FIG. 1 is a perspective front elevation view of a housing for electronic components.

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.

Referenced Cited
U.S. Patent Documents
D304193 October 24, 1989 Lotz
D389840 January 27, 1998 Tucker et al.
D391263 February 24, 1998 Tucker et al.
D404018 January 12, 1999 Tucker et al.
5067785 November 26, 1991 Schirbl et al.
5546282 August 13, 1996 Hill et al.
5828807 October 27, 1998 Tucker et al.
Patent History
Patent number: D414496
Type: Grant
Filed: May 30, 1997
Date of Patent: Sep 28, 1999
Assignee: Next Level Communications (Rohnert Park, CA)
Inventors: Russell L. Tucker (Sebastopol, CA), Mark S. McCall (Santa Rosa, CA), Bernabe R. Lovina (Benecia, CA)
Primary Examiner: Adir Aronovich
Attorney: Skjerven, Morrill, MacPherson, Franklin & Friel, LLP
Application Number: 0/79,335
Classifications
Current U.S. Class: Telephone Equipment (D14/240); Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1403;