Case for headphones

- Sony Corporation
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Description

FIG. 1 is a perspective view of a first embodiment of a case for headphones showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

FIG. 8 is a perspective view of a second embodiment of a case for headphones showing my new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Referenced Cited
U.S. Patent Documents
D307554 May 1, 1990 McAlister, Sr.
D332398 January 12, 1993 Lee et al.
D344019 February 8, 1994 Pratt
D396632 August 4, 1998 Lee
D397865 September 8, 1998 Lin
D406753 March 16, 1999 Lee
4249658 February 10, 1981 Ogura
4583641 April 22, 1986 Gelzer
4669610 June 2, 1987 Lindsey et al.
Other references
  • Modern Packaging Cat. p. 300, 1941. Techform Inc., Nov. 1982. Catalog "Value Up", Sony, MDR-E868LP, MDR-E868SP, MDR-E868MP1, p. 7, (Feb. 1998).
Patent History
Patent number: D415679
Type: Grant
Filed: Jun 25, 1998
Date of Patent: Oct 26, 1999
Assignee: Sony Corporation (Tokyo)
Inventor: Masayuki Hata (Tokyo)
Primary Examiner: Prabhakar Deshmukh
Law Firm: Foley & Lardner
Application Number: 0/89,991
Classifications
Current U.S. Class: D/9415; D9/418
International Classification: 0907;