Hinge unit for vacuum-processing a semiconductor wafer

- Tokyo Electron Limited
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Description

FIG. 1 is a front elevational view of hinge unit for vacuum-processing a semiconductor wafer, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

Referenced Cited
U.S. Patent Documents
D139795 December 1944 Terry
1120163 December 1914 Sanders
4011628 March 15, 1977 Bengtsson
4923054 May 8, 1990 Ohtani et al.
5195210 March 23, 1993 Lee
Patent History
Patent number: D424583
Type: Grant
Filed: Apr 21, 1998
Date of Patent: May 9, 2000
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Masami Mizukami (Kofu)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Lavone D. Tabor
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 0/86,850
Classifications
Current U.S. Class: Material Working, Abrading, Or Founding Machinery (D15/122); D8/323; Element Or Attachment (D15/138); Machine Support Or Frame (D15/141)
International Classification: 1509;