Ratchet wrench
Latest Sawtek, Inc. Patents:
- Wafer level packaging of materials with different coefficients of thermal expansion
- Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
- Surface acoustic wave sensing system and method for measuring pressure and temperature
- Triband passive signal receptor network
- Surface acoustic wave duplexer having enhanced isolation performance
Description
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front view thereof;
FIG. 3 is a side view thereof, the opposite side view being a mirror image;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
The broken line showing in FIGS. 1-3 is for illustrative purposes only and forms no part of the claimed design.
The surface or portion of the article not shown in the drawing or described in the specification forms no part of the claimed design.
Referenced Cited
Patent History
Patent number: D431983
Type: Grant
Filed: Jun 25, 1999
Date of Patent: Oct 17, 2000
Assignee: Sawtek, Inc. (West Chester, OH)
Inventor: David Peters (West Chester, OH)
Primary Examiner: Richelle Shelton
Law Firm: Wood, Herron & Evans LLP
Application Number: 0/107,083
Type: Grant
Filed: Jun 25, 1999
Date of Patent: Oct 17, 2000
Assignee: Sawtek, Inc. (West Chester, OH)
Inventor: David Peters (West Chester, OH)
Primary Examiner: Richelle Shelton
Law Firm: Wood, Herron & Evans LLP
Application Number: 0/107,083
Classifications
Current U.S. Class:
D 8/25
International Classification: 0805;
International Classification: 0805;