Leadframe matrix for a surface mount package
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Description
FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;
FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,
FIG. 3 is a perspective view of FIG. 1.
The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.
Claims
The ornamental design for leadframe matrix for a surface mount package, as shown and described.
Referenced Cited
U.S. Patent Documents
4118859 | October 10, 1978 | Busler |
4234666 | November 18, 1980 | Gursky |
4633582 | January 6, 1987 | Ching et al. |
4809054 | February 28, 1989 | Waldner |
4818960 | April 4, 1989 | Satoh et al. |
4852250 | August 1, 1989 | Andrews |
4865193 | September 12, 1989 | Shimamoto et al. |
5115299 | May 19, 1992 | Wright |
5900582 | May 4, 1999 | Tomita et al. |
6016918 | January 25, 2000 | Ziberna |
Patent History
Patent number: D465207
Type: Grant
Filed: Jun 8, 2001
Date of Patent: Nov 5, 2002
Assignee: GEM Services, Inc. (Santa Clara, CA)
Inventors: Richard K. Williams (Cupertino, CA), James Harnden (Hollister, CA), Anthony Chia (Singapore), Chu Weibing (Shanghai)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Townsend and Townsend and Crew LLP
Application Number: 29/143,226
Type: Grant
Filed: Jun 8, 2001
Date of Patent: Nov 5, 2002
Assignee: GEM Services, Inc. (Santa Clara, CA)
Inventors: Richard K. Williams (Cupertino, CA), James Harnden (Hollister, CA), Anthony Chia (Singapore), Chu Weibing (Shanghai)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Townsend and Townsend and Crew LLP
Application Number: 29/143,226
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182);
Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1303;
International Classification: 1303;