Leadframe matrix for a surface mount package

- GEM Services, Inc.
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Description

FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;

FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.

Claims

The ornamental design for leadframe matrix for a surface mount package, as shown and described.

Referenced Cited
U.S. Patent Documents
4118859 October 10, 1978 Busler
4234666 November 18, 1980 Gursky
4633582 January 6, 1987 Ching et al.
4809054 February 28, 1989 Waldner
4818960 April 4, 1989 Satoh et al.
4852250 August 1, 1989 Andrews
4865193 September 12, 1989 Shimamoto et al.
5115299 May 19, 1992 Wright
5900582 May 4, 1999 Tomita et al.
6016918 January 25, 2000 Ziberna
Patent History
Patent number: D465207
Type: Grant
Filed: Jun 8, 2001
Date of Patent: Nov 5, 2002
Assignee: GEM Services, Inc. (Santa Clara, CA)
Inventors: Richard K. Williams (Cupertino, CA), James Harnden (Hollister, CA), Anthony Chia (Singapore), Chu Weibing (Shanghai)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Townsend and Townsend and Crew LLP
Application Number: 29/143,226