Hybrid integrated circuit device

- Taiyo Yuden Co., Ltd.
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Description

FIG. 1 is a perspective view of a hybird integrated circuit device showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross sectional view, taken along the line A—A of FIG. 6.

Claims

The ornamental design for a hybrid integrated circuit device, as shown and described.

Referenced Cited
U.S. Patent Documents
D357671 April 25, 1995 Terasawa et al.
5742480 April 21, 1998 Sawada et al.
D396450 July 28, 1998 Nishiura et al.
5838546 November 17, 1998 Miyoshi
5905639 May 18, 1999 Warren
6028773 February 22, 2000 Hundt
D430856 September 12, 2000 Wilkerson
6201701 March 13, 2001 Linden et al.
Patent History
Patent number: D465463
Type: Grant
Filed: Feb 19, 2002
Date of Patent: Nov 12, 2002
Assignee: Taiyo Yuden Co., Ltd. (Tokyo)
Inventors: Yoshiyuki Wasada (Tokyo), Tetsuya Ito (Tokyo), Naoki Tomaru (Tokyo)
Primary Examiner: Ted Shooman
Assistant Examiner: Daniel Bui
Attorney, Agent or Law Firm: Bacon & Thomas
Application Number: 29/155,761
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;