Semiconductor element

- Sony Corporation
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Description

FIG. 1 is a top, front perspective view of a semiconductor element showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a front elevational view of another embodiment of a semiconductor element, which is transparent, showing our new design;

FIG. 8 is a rear elevational view thereof;

FIG. 9 is a right side elevational view thereof;

FIG. 10 is a left side elevational view thereof; and,

FIG. 11 is a top plan view thereof, a bottom plan view thereof being a mirror image.

Portions in broken lines are for illustrative purposes only and form no part of claimed design.

Claims

The ornamental design for a semiconductor element, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Other references
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Patent History
Patent number: D472529
Type: Grant
Filed: Jan 17, 2002
Date of Patent: Apr 1, 2003
Assignee: Sony Corporation (Tokyo)
Inventors: Hiroyuki Okuyama (Tokyo), Masato Doi (Tokyo), Goshi Biwa (Tokyo), Toyoharu Oohata (Tokyo)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Rader, Fishman & Grauer PLLC
Application Number: 29/154,047
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;