Semiconductor device
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FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.
Claims
The ornamental design for a semiconductor device, as shown and described.
5401910 | March 28, 1995 | Mandai et al. |
5450286 | September 12, 1995 | Jacques et al. |
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D396846 | August 11, 1998 | Nakayama et al. |
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D444132 | June 26, 2001 | Iwanishi et al. |
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- Website showing a Power MOSFET (P series).
- Catalog showing a Power MOSFET (PowerFLAT).
Type: Grant
Filed: Sep 27, 2002
Date of Patent: Jul 8, 2003
Assignee: Kabushiki Kaisha Toshiba (Tokyo)
Inventors: Takayuki Yoshihira (Yokohama), Gentaro Ookura (Tokyo)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/168,143
International Classification: 1303;