Communications module

- Intel
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Description

FIG. 1 is a top, front, left side perspective view of the communications module showing my new design;

FIG. 2 is a top, rear, left side perspective view thereof;

FIG. 3 is bottom, front, right side perspective view thereof;

FIG. 4 is bottom, rear, right side perspective view thereof;

FIG. 5 is a top plan view of the communications module thereof;

FIG. 6 is a front elevation view of the communications module thereof;

FIG. 7 is a rear elevation view of the communications module thereof;

FIG. 8 is a right side elevation view thereof; and,

FIG. 9 is a left side elevation view thereof.

Claims

The ornamental design for a communications module, as shown and described.

Referenced Cited
U.S. Patent Documents
D366463 January 23, 1996 Ive et al.
D370904 June 18, 1996 Nakata et al.
D415479 October 19, 1999 Yang et al.
D432540 October 24, 2000 Laity et al.
D452495 December 25, 2001 Murnaghan et al.
D452496 December 25, 2001 Murnaghan et al.
D452863 January 8, 2002 Madsen et al.
D458935 June 18, 2002 Hiroki
Patent History
Patent number: D482025
Type: Grant
Filed: Oct 15, 2002
Date of Patent: Nov 11, 2003
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Ian A. Laity (Simi Valley, CA), Michael R. Smither (Castaic, CA)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 29/169,200
Classifications
Current U.S. Class: Acoustic Coupler Or Modem (22) (D14/242); Card Type (D14/436)
International Classification: 1403;