Connectivity module for data link
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Description
FIG. 1 is a perspective view of a connectivity module for data link, showing my new design;
FIG. 2 is a front elevation view thereof, the rear elevation view being a mirror imgae of that shown;
FIG. 3 is a left side elevation view thereof, the right side elevation view being a mirror image of that shown; and,
FIG. 4 is a top plan view thereof, the bottom plan view being a mirror image of that shown.
Claims
The ornamental design for a connectivity module for data link, as shown and described.
Referenced Cited
Patent History
Patent number: D488159
Type: Grant
Filed: Apr 30, 2003
Date of Patent: Apr 6, 2004
Assignee: Aten International Co., Ltd. (Taipei)
Inventor: Chen Sun Chung (Shijr)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: W. Wayne Liauh
Application Number: 29/180,847
Type: Grant
Filed: Apr 30, 2003
Date of Patent: Apr 6, 2004
Assignee: Aten International Co., Ltd. (Taipei)
Inventor: Chen Sun Chung (Shijr)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: W. Wayne Liauh
Application Number: 29/180,847
Classifications
Current U.S. Class:
Adapter, Connector Or Coupler (D14/433);
Connector, Conductor Or Housing Therefor (10) (D13/133)
International Classification: 1402;
International Classification: 1402;