Connectivity module for data link

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Description

FIG. 1 is a perspective view of a connectivity module for data link, showing my new design;

FIG. 2 is a front elevation view thereof, the rear elevation view being a mirror imgae of that shown;

FIG. 3 is a left side elevation view thereof, the right side elevation view being a mirror image of that shown; and,

FIG. 4 is a top plan view thereof, the bottom plan view being a mirror image of that shown.

Claims

The ornamental design for a connectivity module for data link, as shown and described.

Referenced Cited
U.S. Patent Documents
D395282 June 16, 1998 Rudoy et al.
D415102 October 12, 1999 Suzuki et al.
D434381 November 28, 2000 Shimojyo
D436920 January 30, 2001 Lee
D436935 January 30, 2001 Feucht
Patent History
Patent number: D488159
Type: Grant
Filed: Apr 30, 2003
Date of Patent: Apr 6, 2004
Assignee: Aten International Co., Ltd. (Taipei)
Inventor: Chen Sun Chung (Shijr)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: W. Wayne Liauh
Application Number: 29/180,847
Classifications