Computer housing
Latest Thermaltake Technology Co., Ltd. Patents:
Description
FIG. 1 is a top, front and right side perspective view of a computer housing showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is bottom plan view thereof; and,
FIG. 8 is a top, front and left side perspective view thereof.
Claims
The ornamental design for a computer housing, as shown and described.
Referenced Cited
Patent History
Patent number: D494169
Type: Grant
Filed: Sep 24, 2003
Date of Patent: Aug 10, 2004
Assignee: Thermaltake Technology Co., Ltd. (Taiwan Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney, Agent or Law Firm: Rosenberg, Klein & Lee
Application Number: 29/190,542
Type: Grant
Filed: Sep 24, 2003
Date of Patent: Aug 10, 2004
Assignee: Thermaltake Technology Co., Ltd. (Taiwan Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney, Agent or Law Firm: Rosenberg, Klein & Lee
Application Number: 29/190,542
Classifications