Patents by Inventor Pei-Shi Lin

Pei-Shi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hinged panel and disc drive for a computer
    Patent number: 7277278
    Abstract: A panel hingedly connected to the body of a computer that includes an optical disc drive in electrical communication with the computer is provided.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: October 2, 2007
    Assignee: Thermaltake Inc.
    Inventors: Pei-Shi Lin, David Hwang
  • Heat duct-equipped heat-radiating device for power supply
    Patent number: 7085136
    Abstract: A heat duct-equipped heat-radiating device for power supply, including: a heat conductive board tightly attached to a heat source of the power supply; a heat duct tightly bridged over the heat conductive board, one end of the heat duct outward protruding from the housing of the power supply; and a fin body fixedly mounted on outer side of the housing of the power supply. The fins of the fin body are respectively formed with corresponding fitting holes through which the heat duct is fitted to contact with the fins. Accordingly, the heat generated by the heat source of the power supply is quickly conducted through the heat duct to the fin body on outer side of the housing and dissipated from the fin body to outer side.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: August 1, 2006
    Assignee: Thermaltake Technology Ltd.
    Inventor: Pei-Shi Lin
  • Hinged panel and disc drive for a computer
    Publication number: 20060077631
    Abstract: A panel hingedly connected to the body of a computer that includes an optical disc drive in electrical communication with the computer is provided.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 13, 2006
    Inventors: Pei-Shi Lin, David Hwang
  • Heat duct-equipped heat-radiating device for power supply
    Publication number: 20050231917
    Abstract: A heat duct-equipped heat-radiating device for power supply, including: a heat conductive board tightly attached to a heat source of the power supply; a heat duct tightly bridged over the heat conductive board, one end of the heat duct outward protruding from the housing of the power supply; and a fin body fixedly mounted on outer side of the housing of the power supply. The fins of the fin body are respectively formed with corresponding fitting holes through which the heat duct is fitted to contact with the fins. Accordingly, the heat generated by the heat source of the power supply is quickly conducted through the heat duct to the fin body on outer side of the housing and dissipated from the fin body to outer side.
    Type: Application
    Filed: April 14, 2004
    Publication date: October 20, 2005
    Inventor: Pei-Shi Lin
  • Computer mainframe front panel
    Patent number: D501008
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: January 18, 2005
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin
  • Computer mainframe front panel
    Patent number: D502948
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: March 15, 2005
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin
  • Computer mainframe front panel
    Patent number: D505426
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: May 24, 2005
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin
  • Computer housing
    Patent number: D510934
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: October 25, 2005
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin
  • Computer mainframe front panel
    Patent number: D513752
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: January 24, 2006
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin
  • Computer housing
    Patent number: D494169
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: August 10, 2004
    Assignee: Thermaltake Technology Co., Ltd.
    Inventor: Pei-Shi Lin